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Else Kooi Laboratory
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Equipment

Bonding & Packaging
Binder Oven
Disco DAD321
MEI Al bonder 17 mu
MEI Al onder 32 mu
MEI Au Bonder
MEI Pick&Place
TPT Al/Au bonder
Ultron System Foil system
Weld Equipment Pick&Place

Deposition
Aixtron Black Magic
ASM F-120 (ALD) MEMS
ASMI Epsilon 2000
ASMI Epsilon One
Baltzers Cr/Au Evaporator MEMS
CHA Solution Std.
Liquid Silicon Glove Box
LPCVD tube E1 TEOS
LPCVD tube E2 Nitride
LPCVD tube E3 Poly
LPCVD tube E4 SiC
LPCVD tube F1 Boron
LPCVD tube F3 SiC Nitride
Meco Mecoplater Copper MEMS
Novellus Concept 1
Trikon Sigma 204 Dealer
Trikon Sigma 204 Dep A
Trikon Sigma 204 Dep B
Trikon Sigma 204 Dep C
Trikon Sigma 204 HSE
Varian Implanter E500HP

Furnaces & Ovens
Carbolite Ceramic Oven MEMS
Tempress Diffusion Furnaces
Tempress Alloy Furnace
Hereaus Vacuum Oven MEMS
Memmert Oven Oven
Ultra Clean 100


Lithography
ASML PAS 5500/80 waferstepper
Convac Spinner MEMS
EVG 101 Spraycoater
EVG 120 Coater-Developer
EVG 420 Contact Aligner
Flood Exposure Manual
Fusion DUV cure
Karl Suss MA6 Contact Aligner MEMS
Karl Suss MA6/BA6 Contact Aligner MEMS
Laurell Spinner SAL
Manual HMDS
Polos Manual Spinner 1 Cl100
Polos Spinner 1


Measurement
AIT 4 point probe
CDE Resmap 4 pt probe
Dataphysics Contact Angle System OCA20
Dektak 150 MEMS
Dektak 8
Eichorn Wafer Shape
Hydrofobic Tester
Microscope Infrared Setup for Inspection after Bonding
Leitz MPV-SP Leitz MPV-SP MEMS
Logitech Flatness Measurement System
Mettler AT20 Weighing Scale
Microscopes Axiotron
Mitutoyo Linear Gauge
Reflex 300 Particle Measurement
Sagax Layer Thickness
SEM Hitachi S7800-H
SEM JEOL MEMS
SEM Philips XL50
Tencor Alpha-Step SAL
Tencor Flexus Stress
Woollam Ellipsometer


Other
AML Bonder
Freeze/Dry equipment
HF vapor etcher


Plasma Etching
Adixen AMS100
Alcatel GIR300 F etcher
Alcatel GIR300 F/Cl etcher MEMS
Drytek Triode 384T
Europlasma
LAM Rainbow RIE etcher
Rapier Omega i2L DRIE etcher
Tepla Plasma 300
Trikon Omega 201